The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

May. 07, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Yasunari Umemoto, Nagaokakyo, JP;

Shigeki Koya, Nagaokakyo, JP;

Isao Obu, Nagaokakyo, JP;

Kaoru Ideno, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/737 (2006.01); H01L 21/8252 (2006.01); H01L 29/66 (2006.01); H01L 29/15 (2006.01);
U.S. Cl.
CPC ...
H01L 21/8252 (2013.01); H01L 29/157 (2013.01); H01L 29/66333 (2013.01); H01L 29/7371 (2013.01);
Abstract

A collector layer, a base layer, an emitter layer, and an emitter mesa layer are placed above a substrate in this order. A base electrode and an emitter electrode are further placed above the substrate. The emitter mesa layer has a long shape in a first direction in plan view. The base electrode includes a base electrode pad portion spaced from the emitter mesa layer in the first direction. An emitter wiring line and a base wiring line are placed on the emitter electrode and the base electrode, respectively. The emitter wiring line is connected to the emitter electrode via an emitter contact hole. In the first direction, the spacing between the edges of the emitter mesa layer and the emitter contact hole on the side of the base wiring line is smaller than that between the emitter mesa layer and the base wiring line.


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