The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Oct. 09, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
John F. Kaeding, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3178 (2013.01);
Abstract
A method may include forming a set of walls on a surface of a substrate, the set of walls dividing the substrate into multiple sections, each of the multiple sections having at least one respective semiconductor device. The method may further include depositing a molding compound onto the substrate, the molding compound at least partially filling a space defined by the set of walls over each of the multiple sections and covering the respective semiconductor device of each of the multiple sections.