The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Oct. 28, 2019
Applicant:

Rohm and Haas Electronic Materials Korea Ltd., Chungcheongnam-do, KR;

Inventors:

Kahee Shin, Gyeonggi-do, KR;

Eun-Young Lee, Gyeonggi-do, KR;

Jong-Ho Na, Gyeonggi-do, KR;

Geun Huh, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/033 (2006.01); G03F 7/039 (2006.01); C08F 220/14 (2006.01); G03F 7/031 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0233 (2013.01); C08F 220/14 (2013.01); G03F 7/031 (2013.01); G03F 7/033 (2013.01); G03F 7/039 (2013.01);
Abstract

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.


Find Patent Forward Citations

Loading…