The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Oct. 14, 2016
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Yutaka Akaike, Nirasaki, JP;
Takeo Saito, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/26 (2020.01); B24B 1/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2886 (2013.01); B24B 1/00 (2013.01); G01R 31/26 (2013.01); G01R 31/28 (2013.01); H01L 21/6838 (2013.01);
Abstract
There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness tof a polishing plate, a thickness tof a polishing wafer and a magnitude textending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude tof a lip seal protruding from an upper surface of a chuck top.