The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Feb. 27, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Yeong Kim, Suwon-si, KR;

Chin Mo Kim, Suwon-si, KR;

Ji Hyung Jung, Suwon-si, KR;

Sung Nam Cho, Suwon-si, KR;

Sung Yong An, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01Q 1/48 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0457 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01);
Abstract

A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an MgSiOphase, an MgAlOphase, and a CaTiOphase, and a content of the CaTiOphase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.


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