The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Jun. 12, 2020
Applicant:
Sandisk Technologies Llc, Addison, TX (US);
Inventors:
Yanli Zhang, San Jose, CA (US);
Kwang-Ho Kim, Pleasanton, CA (US);
Johann Alsmeier, San Jose, CA (US);
Assignee:
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/00 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 27/11524 (2017.01); H01L 27/11556 (2017.01); H01L 27/11529 (2017.01); H01L 27/1157 (2017.01); H01L 27/11582 (2017.01); H01L 27/11573 (2017.01); G11C 16/04 (2006.01); G11C 16/26 (2006.01); G11C 16/08 (2006.01); G11C 16/30 (2006.01); H01L 27/11519 (2017.01); H01L 27/11565 (2017.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G11C 16/0483 (2013.01); H01L 23/481 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01); H01L 27/11556 (2013.01); H01L 27/11573 (2013.01); H01L 27/11582 (2013.01); G11C 16/08 (2013.01); G11C 16/26 (2013.01); G11C 16/30 (2013.01); H01L 27/11519 (2013.01); H01L 27/11565 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/80894 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/14511 (2013.01);
Abstract
A memory device includes a memory die containing memory elements, a support die containing peripheral devices and bonded to the memory die, and an electrically conductive path between two of the peripheral devices which extends at least partially through the memory die. The electrically conductive path is electrically isolated from the memory elements.