The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
May. 12, 2020
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Kirubakaran Periyannan, Santa Clara, CA (US);
Daniel Linnen, Naperville, IL (US);
Jayavel Pachamuthu, San Jose, CA (US);
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/94 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 25/0657 (2013.01);
Abstract
The present technology relates to a semiconductor device including semiconductor dies formed with vertical die bond pads on an edge of the dies. During wafer fabrication, vertical bond pad blocks are formed in scribe lines of the wafer and electrically coupled to the die bond pads of the semiconductor dies. The vertical bond pad blocks are cut through during wafer dicing, thereby leaving large, vertically oriented pads exposed on a vertical edge of each semiconductor die.