The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

May. 14, 2020
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Yoji Sawada, Ogaki, JP;

Nobuhisa Kuroda, Ogaki, JP;

Kazuyuki Ueda, Ogaki, JP;

Shota Tachibana, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/4644 (2013.01); H01L 24/16 (2013.01); H01L 2224/16238 (2013.01); H05K 1/0298 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A printed wiring board includes a resin insulating layer, a metal post formed in the resin insulating layer such that the metal post is protruding from a first surface of the resin insulating layer, a conductor layer formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the metal post and the conductor layer. The metal post has a protruding portion protruding from the first surface of the resin insulating layer and an embedded portion integrally formed with the protruding portion and embedded in the resin insulating layer.


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