The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Oct. 21, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Joseph AuBuchon, San Jose, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Michael Rice, Pleasanton, CA (US);

Arkaprava Dan, San Jose, CA (US);

Hanhong Chen, Milpitas, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45536 (2013.01); C23C 16/4584 (2013.01); C23C 16/46 (2013.01); H01J 37/32449 (2013.01); H01J 37/32724 (2013.01); H01J 37/32899 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01); H01L 21/67167 (2013.01); H01L 21/67207 (2013.01); H01L 21/67742 (2013.01); H01L 21/68764 (2013.01); H01J 2237/002 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Apparatus and methods to process one or more wafers are described. A first processing station has a first gas flow pattern from one or more of a first gas diffuser, a first cooling channel pattern, or a first heater. A second processing station has a second gas flow pattern from one or more of a second gas diffuser, a second cooling channel pattern, or a second heater. The second gas diffuser, the second cooling channel pattern, or the second heater is rotated or translated relative to the first gas diffuser, the first cooling channel pattern, or the first heater to provide the second gas flow pattern complementary to the first gas flow pattern.


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