The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Dec. 13, 2019
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Materials Co., Ltd., Yokohama, JP;
Inventors:
Tooru Komatsu, Kanagawa, JP;
Nobuaki Nakashima, Kanagawa, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA MATERIALS CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23G 1/02 (2006.01); H01J 37/34 (2006.01); B22D 7/00 (2006.01); C22F 1/10 (2006.01); C22F 1/18 (2006.01); C23C 14/14 (2006.01); C23G 1/10 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22D 7/005 (2013.01); C22F 1/10 (2013.01); C22F 1/18 (2013.01); C22F 1/183 (2013.01); C23C 14/14 (2013.01); C23G 1/02 (2013.01); C23G 1/10 (2013.01); C23G 1/106 (2013.01); H01J 37/3426 (2013.01); H01J 37/3491 (2013.01);
Abstract
The manufacturing cost of a sputtering target is reduced and the impurity concentration of the manufactured sputtering target is also reduced. A method of manufacturing a sputtering target includes: surface-treating at least one of a used sputtering target and a scrap material; melting at least one of the used sputtering target and the scrap material after the surface treatment to form an ingot; and manufacturing a sputtering target by subjecting the ingot to forging, rolling, heat treating, and machining.