The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
May. 09, 2019
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventors:
Ian Flader, Redwood City, CA (US);
Dongyang Kang, San Jose, CA (US);
Assignee:
InvenSense, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00047 (2013.01); B81B 7/02 (2013.01); B81C 1/00531 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/0132 (2013.01); B81C 2203/036 (2013.01);
Abstract
Provided herein is a method including forming a MEMS cap. A cavity is formed in the MEMS cap wafer, and a bond material is deposited on the MEMS cap wafer, wherein the bond material lines the cavity after the depositing. The MEMS cap wafer is bonded to a MEMS device wafer, wherein the bond material forms a bond between the MEMS cap wafer and the MEMS device wafer. A MEMS device is formed in the MEMS device wafer. The bond material is removed from the cavity.