The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Feb. 16, 2020
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Matthew Donofrio, Raleigh, NC (US);

John Edmond, Durham, NC (US);

Harshad Golakia, Morrisville, NC (US);

Eric Mayer, Raleigh, NC (US);

Assignee:

WOLFSPEED, INC., Durham, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); B23K 26/03 (2006.01); B28D 5/00 (2006.01); B23K 26/53 (2014.01); B23K 26/40 (2014.01);
U.S. Cl.
CPC ...
B23K 26/032 (2013.01); B23K 26/40 (2013.01); B23K 26/53 (2015.10); B28D 5/0064 (2013.01); H01L 21/02686 (2013.01);
Abstract

A crystalline material processing method includes forming subsurface laser damage at a first average depth position to form cracks in the substrate interior propagating outward from at least one subsurface laser damage pattern, followed by imaging the substrate top surface, analyzing the image to identify a condition indicative of presence of uncracked regions within the substrate, and taking one or more actions responsive to the analyzing. One potential action includes changing an instruction set for producing subsequent laser damage formation (at second or subsequent average depth positions), without necessarily forming additional damage at the first depth position. Another potential action includes forming additional subsurface laser damage at the first depth position. The substrate surface is illuminated with a diffuse light source arranged perpendicular to a primary substrate flat and positioned to a first side of the substrate, and imaged with an imaging device positioned to an opposing second side of the substrate.


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