The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Sep. 28, 2018
Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Takeshi Mori, Tokyo, JP;

Hidekazu Nakayama, Tokyo, JP;

Isao Ichikawa, Tokyo, JP;

Yukiharu Nose, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); H01B 1/22 (2006.01); H01L 21/52 (2006.01); B22F 7/08 (2006.01); H01R 11/01 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0059 (2013.01); B22F 1/0022 (2013.01); B22F 1/0062 (2013.01); B22F 1/0074 (2013.01); B22F 7/08 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H01L 21/52 (2013.01); H01R 11/01 (2013.01); B22F 2001/0092 (2013.01); B22F 2999/00 (2013.01);
Abstract

The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (), a binder component (), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.


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