The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Jun. 13, 2019
Texas Instruments Incorporated, Dallas, TX (US);
Makoto Shibuya, Beppu, JP;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
In described examples, a packaged semiconductor device includes a frame, a pre-fabricated interposer, and an integrated circuit die. The frame includes multiple conductive frame leads and multiple conductive connection points, as well as a hole in the frame surrounded by the frame leads and the conductive connection points. The pre-molded interposer has an external perimeter including multiple conductive interposer leads, and is for insertion into the hole. At least one of the interposer leads does not extend to the external perimeter of the interposer. The die is electrically coupled to selected ones of the frame leads and of the interposer leads. The interposer is inserted into the hole and coupled to the frame, and the frame, interposer, and die are together encapsulated by encapsulation material.