The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Mar. 20, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Daiki Komatsu, Beppu, JP;
Makoto Shibuya, Beppu, JP;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);
Abstract
An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.