The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Mar. 30, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

David Benjaminson, Santa Clara, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Ananda Seelavanth Math, Bangalore, IN;

Saravanakumar Natarajan, Coimbatore, IN;

Shubham Chourey, Indore, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01J 37/32082 (2013.01); H01J 37/32357 (2013.01); H01J 37/32724 (2013.01); H01L 21/324 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01);
Abstract

A workpiece holder includes a puck, first and second heating devices in thermal communication with respective inner and outer portions of the puck, and a thermal sink in thermal communication with the puck. The first and second heating devices are independently controllable, and the first and second heating devices are in greater thermal communication with the puck, than thermal communication of the thermal sink with the puck. A method of controlling temperature distribution of a workpiece includes flowing a heat exchange fluid through a thermal sink to establish a reference temperature to a puck, raising temperatures of radially inner and outer portions of the puck to first and second temperatures greater than the reference temperature, by activating respective first and second heating devices disposed in thermal communication with the radially inner and outer portions of the puck, and placing the workpiece on the puck.


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