The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Sep. 25, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Takashi Ando, Eastchester, NY (US);

Pouya Hashemi, Purchase, NY (US);

Hemanth Jagannathan, Niskayuna, NY (US);

ChoongHyun Lee, Rensselaer, NY (US);

Vijay Narayanan, New York, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/161 (2006.01); H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 21/84 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28255 (2013.01); H01L 21/02236 (2013.01); H01L 21/02247 (2013.01); H01L 21/02255 (2013.01); H01L 21/02326 (2013.01); H01L 21/845 (2013.01); H01L 29/161 (2013.01); H01L 29/4966 (2013.01); H01L 29/513 (2013.01); H01L 29/66545 (2013.01); H01L 29/66575 (2013.01); H01L 29/66795 (2013.01); H01L 29/78 (2013.01); H01L 29/785 (2013.01);
Abstract

Methods are provided to form pure silicon oxide layers on silicon-germanium (SiGe) layers, as well as an FET device having a pure silicon oxide interfacial layer of a metal gate structure formed on a SiGe channel layer of the FET device. For example, a method comprises growing a first silicon oxide layer on a surface of a SiGe layer using a first oxynitridation process, wherein the first silicon oxide layer comprises nitrogen. The first silicon oxide layer is removed, and a second silicon oxide layer is grown on the surface of the SiGe layer using a second oxynitridation process, which is substantially the same as the first oxynitridation process, wherein the second silicon oxide layer is substantially devoid of germanium oxide and nitrogen. For example, the first silicon oxide layer comprises a SiON layer and the second silicon oxide layer comprises a pure silicon dioxide layer.


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