The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Aug. 15, 2018
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Huang-Hsien Chang, Kaohsiung, TW;

Po Ju Wu, Kaohsiung, TW;

Yu Cheng Chen, Kaohsiung, TW;

Wen-Long Lu, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/44 (2006.01); G02B 6/36 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/3636 (2013.01); G02B 6/4257 (2013.01); G02B 6/44 (2013.01);
Abstract

An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.


Find Patent Forward Citations

Chang, Huang-Hsien. (2022). Optical device package and method for manufacturing the same (U.S. Patent No. 11215762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11215762

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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