The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 03, 2020
Applicant:

Guangdong University of Technology, Guangdong, CN;

Inventors:

Chengqiang Cui, Guangdong, CN;

Guannan Yang, Guangdong, CN;

Guangdong Xu, Guangdong, CN;

Yu Zhang, Guangdong, CN;

Xin Chen, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); H05K 3/26 (2006.01); H05K 1/09 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/225 (2013.01); H05K 1/097 (2013.01); H05K 3/26 (2013.01); H05K 3/288 (2013.01); H05K 1/09 (2013.01); H05K 2203/013 (2013.01); H05K 2203/0104 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/025 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.


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