The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jan. 29, 2018
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Kenji Kubota, Naka, JP;

Yoshie Tarutani, Naka, JP;

Kiyotaka Nakaya, Naka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 7/00 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01); H01R 13/03 (2006.01); H01R 4/18 (2006.01); H01R 4/62 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 5/12 (2013.01); C25D 7/00 (2013.01); H01R 4/185 (2013.01); H01R 4/62 (2013.01);
Abstract

A terminal material for a connector terminal, using a copper or copper alloy substrate is crimped to an end of wire formed from an aluminum wire material; and a terminal using this terminal material: a zinc layerthat is formed of zinc or a zinc alloy and a tin layerthat is formed of tin or a tin alloy are sequentially laminated in this order on a substratethat is formed of copper or a copper alloy: with respect to the zinc layer and the tin layer, the adhesion amount of tin contained in the whole layers is from 0.5 mg/cmto 7.0 mg/cm(inclusive) and the adhesion amount of zinc contained in the whole layers is from 0.07 mg/cmto 2.0 mg/cm(inclusive), and the content percentage of zinc in the vicinity of the surface is from 0.2% by mass to 10.0% by mass (inclusive).


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