The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jul. 24, 2020
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Toshiyuki Nitta, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 2933/0058 (2013.01);
Abstract

A method for manufacturing an optical semiconductor device includes the steps of bonding a chip including a first substrate and a compound semiconductor layer disposed on the first substrate to a second substrate including silicon such that the compound semiconductor layer faces the second substrate; after the step of bonding the chip, etching the first substrate; after the etching step, forming a resist having a residue of the first substrate exposed therefrom and covering the compound semiconductor layer and the second substrate; and after the step of forming the resist, etching the residue.


Find Patent Forward Citations

Nitta, Toshiyuki. (2021). Method for manufacturing optical semiconductor device (U.S. Patent No. 11211523). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11211523

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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