The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Feb. 27, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Tongbi T. Jiang, Santa Clara, CA (US);

Miaolei Yan, Santa Clara, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 31/16 (2006.01); H01L 33/56 (2010.01); H01L 31/02 (2006.01); H01L 25/16 (2006.01); G01J 1/42 (2006.01); G01N 27/04 (2006.01);
U.S. Cl.
CPC ...
H01L 31/16 (2013.01); G01J 1/42 (2013.01); H01L 25/167 (2013.01); H01L 31/02002 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); G01N 27/04 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.


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