The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Dec. 11, 2017
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Akira Noda, Kitaibaraki, JP;

Masaru Ota, Kitaibaraki, JP;

Ryuichi Hirano, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0304 (2006.01); H01L 31/18 (2006.01); C30B 15/22 (2006.01); C30B 27/02 (2006.01); C30B 29/42 (2006.01); H01L 31/0735 (2012.01); C30B 15/20 (2006.01); C30B 29/40 (2006.01); C30B 15/04 (2006.01); C30B 15/30 (2006.01);
U.S. Cl.
CPC ...
H01L 31/03042 (2013.01); C30B 15/04 (2013.01); C30B 15/20 (2013.01); C30B 15/203 (2013.01); C30B 15/22 (2013.01); C30B 15/30 (2013.01); C30B 27/02 (2013.01); C30B 29/40 (2013.01); C30B 29/42 (2013.01); H01L 31/0735 (2013.01); H01L 31/184 (2013.01); Y02E 10/544 (2013.01); Y02P 70/50 (2015.11);
Abstract

In this photoelectric conversion element wherein group III-IV compound semiconductor single crystals containing zinc as an impurity are used as a substrate, the substrate is increased in size without lowering conversion efficiency. A heat-resistant crucible is filled with raw material and a sealant, and the raw material and sealant are heated, thereby melting the raw material into a melt, softening the encapsulant, and covering the melt from the top with the encapsulant. The temperature inside the crucible is controlled such that the temperature of the top of the encapsulant relative to the bottom of the encapsulant becomes higher in a range that not equal or exceed the temperature of bottom of the encapsulant, and seed crystal is dipped in the melt and pulled upward with respect to the melt, thereby growing single crystals from the seed crystal. Thus, a large compound semiconductor wafer that is at least two inches in diameter and has a low dislocation density of 5,000 cmcan be obtained, despite having a low average zinc concentration of 5×10cmto 3×10cm, at which a crystal hardening effect does not manifest.


Find Patent Forward Citations

Loading…