The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Mar. 06, 2020
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Yuta Sonoda, Tokyo, JP;

Yukiya Kato, Tokyo, JP;

Hiroto Narieda, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); C25D 3/46 (2006.01); C25D 15/00 (2006.01); C25D 5/12 (2006.01);
U.S. Cl.
CPC ...
C25D 3/46 (2013.01); C25D 5/12 (2013.01); C25D 15/00 (2013.01); Y10T 428/12493 (2015.01);
Abstract

There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.


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