The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Dec. 28, 2018
Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroyoshi Kawasaki, Tokyo, JP;

Masato Shiratori, Tokyo, JP;

Tomohisa Kawanago, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/362 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 35/025 (2013.01);
Abstract

A flux in which solder wettability can be maintained and with which it is possible to suppress the amount of residue after soldering and realize low residue. This flux includes 65-99 wt % of a solvent, and also includes 1-13 wt % of at least one acid selected form a dimer acid that is a reaction product of oleic acid and linoleic acid; a trimer acid that is a reaction product of oleic acid and linoleic acid; a hydrogenated dimer acid obtained by hydrogenating dimer acid that is a reaction product of oleic acid and linoleic acid; and a hydrogenated trimer acid obtained by hydrogenating a trimer acid that is a reaction product of oleic acid and linoleic acid.


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