The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Sep. 04, 2020
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Masatoshi Arai, Hakusan Ishikawa, JP;
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Abstract
A semiconductor device includes: a first semiconductor layer of first conductivity type; a second semiconductor layer of first conductivity type provided on the first semiconductor layer and having a first region and a second region; a first semiconductor region of second conductivity type provided on the first region; a second semiconductor region of first conductivity type provided on the first semiconductor region; a second electrode provided in a first trench reaching the first region from above the first semiconductor region, the second electrode facing the first semiconductor region via a first insulating film, the second electrode being electrically connected to a first electrode provided above the first semiconductor layer; a fourth electrode provided below the second electrode in the first trench, the fourth electrode facing the first region via a second insulating film, the fourth electrode being electrically connected to a third electrode provided on the second semiconductor region and electrically connected to the second semiconductor region; a third semiconductor region of second conductivity type provided on the second region; a fourth semiconductor region of first conductivity type provided on the third semiconductor region; a fifth electrode provided in a second trench reaching the second region from above the third semiconductor region, the fifth electrode facing the third semiconductor region via a third insulating film, the fifth electrode being electrically connected to the first electrode; and a sixth electrode provided below the fifth electrode in the second trench, the sixth electrode facing the second region via a fourth insulating film, the sixth electrode being electrically connected to the first electrode.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile