The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Nov. 01, 2019
Ningbo Semiconductor International Corporation, Ningbo, CN;
Yanghui Xiang, Ningbo, CN;
Ningbo Semiconductor International Corporation, Ningbo, CN;
Abstract
A CMOS image sensor packaging structure and a fabrication method thereof, and a camera device are provided. The packaging structure includes a pixel circuit substrate including a photosensitive region and a readout circuit region. A pixel array is disposed in the photosensitive region, and the readout circuit including a circuit interconnection terminal is disposed in the readout circuit region. The pixel circuit substrate includes a first surface and a second surface that are oppositely disposed. The packaging structure also includes a bonding layer disposed on the first surface. Moreover, the packaging structure includes a signal processing chip disposed above the first surface through the bonding layer. The signal processing chip includes a chip interconnection terminal. In addition, the packaging structure includes an interconnection structure electrically connected to the chip interconnection terminal and the circuit interconnection terminal. Further, the packaging structure includes a redistribution layer disposed on the second surface.