The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Feb. 23, 2018
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Kohei Yamauchi, Matsumoto, JP;
Hiromichi Gohara, Matsumoto, JP;
Ryoichi Kato, Matsumoto, JP;
Yoshinari Ikeda, Matsumoto, JP;
Katsumi Taniguchi, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/46 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/295 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/84 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8484 (2013.01); H01L 2224/8485 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1302 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13032 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A semiconductor device encompasses a cooler made of ceramics, having a first main face and a second main face, being parallel and opposite to the first main face, defined by two opposite side faces perpendicular to the first and second main faces, a plurality of conductive-pattern layers delineated on the first main face, a semiconductor chip mounted on the first main face via one of the plurality of conductive-pattern layers, and a seal member configured to seal the semiconductor chip.