The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Feb. 20, 2019
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Ohad Shaubi, Yavne, IL;

Assaf Asbag, Alfei Menashe, IL;

Boaz Cohen, Lehavim, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G06N 3/08 (2006.01); G06T 7/00 (2017.01); G01N 21/956 (2006.01); G06T 7/174 (2017.01); G06F 30/20 (2020.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G06F 30/20 (2020.01); G06N 3/08 (2013.01); G06T 7/0004 (2013.01); G06T 7/174 (2017.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01);
Abstract

There is provided a system and method of generating a training set usable for examination of a semiconductor specimen. The method comprises: obtaining a simulation model capable of simulating effect of a physical process on fabrication process (FP) images depending on the values of parameters of the physical process; applying the simulation model to an image to be augmented for the training set and thereby generating one or more augmented images corresponding to one or more different values of the parameters of the physical process; and including the generated one or more augmented images into the training set. The training set can be usable for examination of the specimen using a trained Deep Neural Network, automated defect review, automated defect classification, automated navigation during the examination, automated segmentation of FP images, automated metrology based on FP images and other examination processes that include machine learning.


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