The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Jul. 14, 2017
Applicant:

Eternal Materials Co., Ltd., Kaohsiung, TW;

Inventors:

Chung-Kai Cheng, Kaohsiung, TW;

Chung-Jen Wu, Kaohsiung, TW;

Meng-Yen Chou, Kaohsiung, TW;

Chang-Hong Ho, Kaohsiung, TW;

Po-Yu Huang, Kaohsiung, TW;

Shun-Jen Chiang, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 179/08 (2006.01); C08G 73/10 (2006.01); H01L 27/32 (2006.01); C08G 73/14 (2006.01); C08L 63/00 (2006.01); H05K 3/00 (2006.01); C09J 7/35 (2018.01); B32B 27/28 (2006.01); H05K 1/03 (2006.01); B29K 79/00 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); B32B 27/281 (2013.01); C08G 73/1003 (2013.01); C08G 73/1039 (2013.01); C08G 73/1067 (2013.01); C08G 73/14 (2013.01); C08L 63/00 (2013.01); C09J 7/35 (2018.01); H01L 27/3241 (2013.01); H05K 1/0393 (2013.01); H05K 3/007 (2013.01); H05K 3/0064 (2013.01); B29K 2079/08 (2013.01); C09J 2203/326 (2013.01); C09J 2479/08 (2013.01); C09J 2479/086 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/016 (2013.01); H05K 2203/0156 (2013.01);
Abstract

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.


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