The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Jun. 01, 2016
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Shoji Akiyama, Annaka, JP;

Makoto Kawai, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/06 (2006.01); H01L 41/312 (2013.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); B32B 9/00 (2006.01); B32B 18/00 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); C01G 33/00 (2006.01); C01G 35/00 (2006.01); C30B 29/30 (2006.01); C30B 31/22 (2006.01); H01L 21/762 (2006.01); H01L 41/187 (2006.01); H01L 41/338 (2013.01);
U.S. Cl.
CPC ...
H01L 41/312 (2013.01); B32B 9/005 (2013.01); B32B 17/06 (2013.01); B32B 18/00 (2013.01); B32B 37/18 (2013.01); B32B 38/0036 (2013.01); B32B 38/10 (2013.01); C01G 33/006 (2013.01); C01G 35/006 (2013.01); C30B 29/30 (2013.01); C30B 31/22 (2013.01); H01L 21/02 (2013.01); H01L 21/265 (2013.01); H01L 21/76254 (2013.01); H01L 41/1873 (2013.01); H01L 41/338 (2013.01); B32B 2250/02 (2013.01); B32B 2260/02 (2013.01); B32B 2260/04 (2013.01); B32B 2307/20 (2013.01); B32B 2310/0806 (2013.01); B32B 2311/00 (2013.01); B32B 2313/00 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01);
Abstract

A composite wafer having an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, including steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof; subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90° C. or higher at which cracking is not caused; and exposing the heat-treated laminate to visible light to split along the ion-implanted layer to obtain the composite wafer.


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