The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Jan. 25, 2018
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Naoki Tomori, Tokyo, JP;
Tomohiro Nagoya, Tokyo, JP;
Assignee:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 23/29 (2013.01); H01L 23/49811 (2013.01); H01L 23/49861 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01);
Abstract
Disclosed is a temporary protective film for semiconductor sealing moldingincluding a support film; and an adhesive layerprovided on the support filmand containing an acrylic rubber. A solid shear modulus at 200° C. of the temporary protective film for semiconductor sealing moldingmay be 5.0 MPa or higher.