The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Jan. 11, 2019
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-Ken, JP;
Inventor:
Takahiko Kiso, Nagano, JP;
Assignee:
Shinko Electric Industries Co., LTD., Nagano-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28D 21/00 (2006.01); F28F 3/08 (2006.01);
U.S. Cl.
CPC ...
F28D 15/043 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/0283 (2013.01); F28D 2021/0028 (2013.01); F28F 3/086 (2013.01);
Abstract
A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.