The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Dec. 07, 2015
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Shanyin Yan, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Zhongqiang Yang, Guangdong, CN;

Yongming Zhu, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); C03C 25/47 (2018.01); C03C 25/1095 (2018.01); D06M 15/53 (2006.01); C09D 109/00 (2006.01); C09D 171/12 (2006.01); D06M 11/44 (2006.01); D06M 11/45 (2006.01); D06M 11/46 (2006.01); D06M 15/233 (2006.01); D06M 23/10 (2006.01); H05K 3/38 (2006.01); H05K 1/02 (2006.01); C08K 3/22 (2006.01); D06M 101/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); C03C 25/1095 (2013.01); C03C 25/47 (2018.01); C09D 109/00 (2013.01); C09D 171/12 (2013.01); D06M 11/44 (2013.01); D06M 11/45 (2013.01); D06M 11/46 (2013.01); D06M 15/233 (2013.01); D06M 15/53 (2013.01); D06M 23/10 (2013.01); H05K 1/0366 (2013.01); H05K 3/381 (2013.01); C08K 3/22 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); D06M 2101/00 (2013.01); H05K 1/024 (2013.01); H05K 1/0373 (2013.01);
Abstract

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.


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