The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Dec. 10, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hongqing Zhang, Hopewell Junction, NY (US);

Jay A. Bunt, Esopus, NY (US);

Shidong Li, Hopewell Junction, NY (US);

Zhigang Song, Hopewell Junction, NY (US);

Junjun Li, Hopewell Junction, NY (US);

Guoda Lian, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); H05K 3/30 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is coupled to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes an enclosure with a sealed inner compartment, and a structural material within the sealed inner compartment of the enclosure. The structural material within the enclosure inhibits deflection of the enclosure due to a pressure differential between pressure of the sealed inner compartment and pressure around, at least in part, the enclosure. The pressure sensor senses pressure within the sealed inner compartment of the enclosure to facilitate identifying a pressure change indicative of a tamper event.


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