The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Mar. 29, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kevin Clark, San Jose, CA (US);

Scott J. Weber, Piedmont, CA (US);

Ravi Prakash Gutala, San Jose, CA (US);

Aravind Raghavendra Dasu, Milpitas, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 12/933 (2013.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H04L 49/109 (2013.01); H01L 25/0652 (2013.01); H04L 49/15 (2013.01); H01L 23/5386 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01);
Abstract

This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.


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