The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Dec. 26, 2016
Applicant:
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Inventors:
Yoshihiro Ueoka, Chiba, JP;
Takashi Sekiya, Chiba, JP;
Shigekazu Tomai, Chiba, JP;
Emi Kawashima, Chiba, JP;
Yuki Tsuruma, Chiba, JP;
Motohiro Takeshima, Chiba, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 29/04 (2006.01); H01L 29/786 (2006.01); H01L 29/24 (2006.01); H01L 29/26 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 29/04 (2013.01); H01L 29/78693 (2013.01); H01L 29/247 (2013.01); H01L 29/26 (2013.01);
Abstract
A laminated body comprising a substrate, one or more layers selected from a contact resistance reducing layer and a reduction suppressing layer, a Schottky electrode layer and a metal oxide semiconductor layer in this order.