The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Dec. 31, 2019
Fuji Electric Co., Ltd., Kawasaki, JP;
Nobuhiro Higashi, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A semiconductor module includes a laminated substrate that includes a heat radiating plate, and an insulation layer having a conductive pattern thereof and being disposed on a top surface of the heat radiating plate, a semiconductor element disposed on a top surface of the conductive pattern, an integrated circuit that controls driving of the semiconductor element, a control-side lead frame having a primary surface on which the integrated circuit is disposed, and a mold resin that seals the laminated substrate, the semiconductor element, the integrated circuit, and the control-side lead frame. The control-side lead frame has a rod-shaped first pin having a first end, a first end side of the first pin extending toward the top surface of the heat radiating plate, and the heat radiating plate has at least one insertion hole into one of which the first end of the first pin is press-fitted.