The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Mar. 21, 2012
Applicants:

Khalil Hosseini, Weihmichl, DE;

Joachim Mahler, Regensburg, DE;

Edward Fuergut, Dasing, DE;

Inventors:

Khalil Hosseini, Weihmichl, DE;

Joachim Mahler, Regensburg, DE;

Edward Fuergut, Dasing, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/051 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/051 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 24/83 (2013.01); H01L 24/96 (2013.01); H01L 23/3107 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/75 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/331 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/753 (2013.01); H01L 2224/8346 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/96 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13034 (2013.01); H01L 2924/13091 (2013.01); Y10T 29/49146 (2015.01);
Abstract

A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.


Find Patent Forward Citations

Loading…