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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11189530 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Apr. 07, 2020

Manufacturing method of chips

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Naoko Yamamoto, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Moazzam Hossain

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); H01L 29/1608 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/5446 (2013.01);
Abstract

A manufacturing method of chips from a workpiece including plural planned dividing lines on a front surface includes a cutting step of causing a cutting blade to cut into the workpiece for which a side of the front surface of the workpiece is held by a holding table in such a manner that a side of a back surface of the workpiece is exposed and forming a cut groove that does not reach the front surface of the workpiece on the side of the back surface of the workpiece along each planned dividing line, a sticking step of sticking an expanding sheet to the workpiece, and a dividing step of dividing the workpiece along each planned dividing line by expanding the expanding sheet to form the chips from the workpiece after the sticking step and the cutting step.

Find Patent Forward Citations

Yamamoto, Naoko. (2021). Manufacturing method of chips (U.S. Patent No. 11189530). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11189530

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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