The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Jun. 12, 2019
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Shing-Yih Shih, New Taipei, TW;

Mao-Ying Wang, New Taipei, TW;

Hung-Mo Wu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76804 (2013.01); H01L 21/76805 (2013.01); H01L 21/76883 (2013.01); H01L 23/3192 (2013.01); H01L 23/5226 (2013.01);
Abstract

A method of forming a semiconductor structure includes the following steps. A dielectric layer is formed over a conductive line. A photoresist layer is formed over the dielectric layer. The photoresist layer is patterned to form a mask feature and an opening is defined by the mask feature. The opening has a bottom portion and a top portion communicated to the bottom portion, and the top portion is wider than the bottom portion. The dielectric layer is etched to form a via hole in the dielectric layer using the mask feature as an etch mask, such that the via hole has a bottom portion and a tapered portion over the bottom portion. The conductive material is filled in the via hole to form a conductive via.


Find Patent Forward Citations

Loading…