The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Apr. 30, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yung-Chang Huang, Taichung, TW;
Tsun-En Kuo, Taichung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); G01L 5/00 (2006.01); C25D 7/12 (2006.01); G01L 5/22 (2006.01); C25D 17/06 (2006.01); H01L 21/68 (2006.01); C25D 17/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G01L 5/009 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); G01L 5/226 (2013.01); H01L 21/68 (2013.01); H01L 21/6838 (2013.01); H01L 21/76873 (2013.01);
Abstract
A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. A pressure force applied by the cone against the wafer is detected. Stopping clamping the wafer when the pressure force is higher than a predetermined value.
Huang, Yung-Chang. (2021). Device and method for pressure force inspection (U.S. Patent No. 11187602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11187602
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile