The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

May. 20, 2020
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Seoul National University R&db Foundation, Seoul, KR;

Inventors:

Boyun Kim, Hwaseong, KR;

Yeryung Jeon, Suwon, KR;

Boun Yoon, Seoul, KR;

Taek Dong Chung, Gwacheon, KR;

Jae Gyeong Lee, Suwon, KR;

Jin-Young Lee, Yongin, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09G 1/04 (2006.01); C09K 15/02 (2006.01); H01L 21/768 (2006.01); H01L 21/321 (2006.01); C09G 1/00 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); B24B 1/00 (2006.01); C09G 1/06 (2006.01); C09K 13/06 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); C09K 15/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76846 (2013.01); H01L 21/76877 (2013.01); B24B 37/044 (2013.01);
Abstract

A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.


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