The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Sep. 26, 2017
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/22 (2006.01); C09D 163/00 (2006.01); C09D 7/61 (2018.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C08K 3/00 (2018.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/50 (2013.01); C08K 3/00 (2013.01); C08L 63/00 (2013.01); C09D 7/61 (2018.01); H01L 21/56 (2013.01); H01L 23/29 (2013.01); H01L 23/295 (2013.01); H01L 23/31 (2013.01); H01L 23/3121 (2013.01);
Abstract
A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm/g or more.