The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Nov. 02, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen Hsiung Yang, Hsinchu County, TW;

Chun-Wen Cheng, Hsinchu County, TW;

Jiou-Kang Lee, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/29 (2013.01); B81C 1/00 (2006.01); G01P 15/125 (2006.01); G01P 15/08 (2006.01); G01L 1/18 (2006.01); B81B 5/00 (2006.01); H01L 41/25 (2013.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 5/00 (2013.01); B81C 1/00166 (2013.01); G01L 1/18 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); H01L 41/25 (2013.01); H01L 41/29 (2013.01);
Abstract

A sensor device includes a microelectromechanical system (MEMS) force sensor, and a capacitive acceleration sensor. In the method of manufacturing the sensor device, a sensor portion of the MEMS force sensor is prepared over a front surface of a first substrate. The sensor portion includes a piezo-resistive element and a front electrode. A bottom electrode and a first electrode are formed on a back surface of the first substrate. A second substrate having an electrode pad and a second electrode to the bottom of the first substrate are attached such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.


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