The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Jul. 30, 2018
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Cyrus Emil Tabery, San Jose, CA (US);

Hakki Ergün Cekli, Singapore, SG;

Simon Hendrik Celine Van Gorp, Oud-Turnhout, BE;

Chenxi Lin, Newark, CA (US);

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70525 (2013.01); G03F 7/7085 (2013.01); G03F 7/70558 (2013.01); G03F 7/70633 (2013.01); G03F 7/70641 (2013.01); H01L 22/20 (2013.01);
Abstract

A method for determining a control parameter for an apparatus used in a semiconductor manufacturing process, the method including: obtaining performance data associated with a substrate subject to the semiconductor manufacturing process; obtaining die specification data including values of an expected yield of one or more dies on the substrate based on the performance data and/or a specification for the performance data; and determining the control parameter in dependence on the performance data and the die specification data. Advantageously, the efficiency and/or accuracy of processes is improved by determining how to perform the processes in dependence on dies within specification.


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