The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2021
Filed:
Jul. 16, 2018
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Vijay D. Parkhe, San Jose, CA (US);
Kadthala Ramaya Narendrnath, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 21/461 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); B24B 37/04 (2012.01); B24B 37/26 (2012.01); B24C 1/04 (2006.01); B24C 1/06 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B44C 1/221 (2013.01); B24B 37/042 (2013.01); B24B 37/26 (2013.01); B24C 1/04 (2013.01); B24C 1/06 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/461 (2013.01); H01L 21/6833 (2013.01);
Abstract
An electrostatic chuck includes a metal base plate, an electrostatic puck bonded to the metal base plate, and surface features on the surface of the electrostatic puck. The electrostatic puck includes an electrode embedded in the electrostatic puck. A surface of the electrostatic puck has a flatness of below 10 microns. The surface features include mesas and a sealing band around a perimeter of the electrostatic puck. The surface features have an average surface roughness of approximately 2-6 micro-inches. The corners of the surface features are not rounded.