The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Mar. 30, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Kai Liu, San Diego, CA (US);

Xiaoju Yu, San Diego, CA (US);

Xia Li, San Diego, CA (US);

Bin Yang, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01F 27/22 (2006.01); H01G 4/33 (2006.01); H01F 27/29 (2006.01); H01G 4/252 (2006.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 27/29 (2013.01); H01G 4/252 (2013.01); H01G 4/33 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01);
Abstract

Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.


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