The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Jun. 23, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Takayori Hamada, Kanagawa, JP;
Yasuhiko Tanuma, Kanagawa, JP;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); H01L 23/522 (2006.01); G11C 7/10 (2006.01);
U.S. Cl.
CPC ...
G11C 5/063 (2013.01); G11C 7/1084 (2013.01); H01L 23/5226 (2013.01);
Abstract
Semiconductor devices and systems are disclosed. A semiconductor device includes a redistribution layer including a first polygonal structure for conveying a first power signal and including a first cutout region. The semiconductor device further includes a second polygonal structure for conveying a second power signal. Further, the semiconductor device includes an island polygon for conveying a third power signal and positioned within the first cutout region, wherein the island polygon does not touch the first polygonal structure.