The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

May. 23, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sun-Cheul Kim, Hwaseong-si, KR;

Kap-Soo Lee, Suwon-si, KR;

Keun-Young Lee, Suwon-si, KR;

Hong-Taek Lim, Seoul, KR;

Jeong-Woo Hyun, Seoul, KR;

Dong-Hoon Han, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/02 (2006.01); C23C 16/44 (2006.01); C23C 16/50 (2006.01); C23C 16/06 (2006.01); C23C 16/34 (2006.01); H01L 21/285 (2006.01); H01J 37/32 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
C23C 16/4405 (2013.01); C23C 16/0272 (2013.01); C23C 16/06 (2013.01); C23C 16/34 (2013.01); C23C 16/50 (2013.01); H01J 37/32467 (2013.01); H01J 37/32862 (2013.01); H01L 21/28556 (2013.01); H01J 2237/3321 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract

In a substrate processing method, a cleaning process is performed at a first temperature to remove a portion of a cumulative layer that is deposited within a chamber by deposition processes (step 1). The deposition processes are performed at the first temperature on a plurality of substrates within the chamber respectively (step 2). The step 1 and the step 2 are performed alternately and repeatedly.


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